Semiconductor device

Details Semiconductor device Semiconductor device

2007-07-31

2010-06-01

Ha, Nathan W (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257SE25027

Reexamination Certificate

active

07727807

ABSTRACT:
A semiconductor device according to embodiments may include an interposer, a plurality of devices stacked on the interposer, a cooling device provided in at least one of the devices and including a passage for a cooling material, and a connection electrode provided between the devices, in which the connection electrode connects a signal electrode in an upper device to a signal electrode in a lower device.

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