Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Reexamination Certificate

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Details

C257S723000, C257S706000, C257S713000, C257S777000, C257SE23174

Reexamination Certificate

active

07656030

ABSTRACT:
Heating elements different in heat generating timing are laminated in a stacked state, and the heating element close to a wiring substrate is allowed to function as a heat diffusion plate for another heating element.

REFERENCES:
patent: 6507110 (2003-01-01), Chen et al.
patent: 7230316 (2007-06-01), Yamazaki et al.
patent: 7396701 (2008-07-01), Shigemura et al.
patent: 7554167 (2009-06-01), Vaganov
patent: 2005/0180122 (2005-08-01), Okabe
patent: 2000-031309 (2000-01-01), None
patent: 2001-035994 (2001-02-01), None
patent: 2001-102483 (2001-04-01), None
patent: 2004-071597 (2004-03-01), None

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