Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent
1998-09-18
2000-02-01
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
257673, 257693, 257738, H01L 2348, H01L 23495
Patent
active
060206268
ABSTRACT:
A semiconductor device is provided which can improve a heat radiation characteristic of the package, and also can solve an uniform characteristic of ball sizes when a projection electrode such as soldering balls is formed by way of the electrolytic plating method. A semiconductor device is comprised of: a semiconductor chip in having a plurality of electrode pads and an inside of a pad forming region thereof used as an effective element region; a reinforcement plate provided under such a condition that this semiconductor chip is surrounded by the reinforcement plate; a plurality of leads constituted by an outer lead and an inner lead, in which a projection electrode is provided on the outer lead, and also a tip portion of the inner lead is connected to the electrode pads sealing resin filled into a peripheral region of the semiconductor chip. A conductor pattern is formed on the effective element region of the semiconductor chip; and the conductor pattern is covered by an insulating film to be protected; and further a projection electrode is provided on this conductor pattern.
REFERENCES:
patent: 5506756 (1996-04-01), Haley
patent: 5656550 (1997-08-01), Tsuji et al.
patent: 5726491 (1998-03-01), Tajima et al.
patent: 5729051 (1998-03-01), Nakamura
patent: 5744859 (1998-04-01), Ouchida
patent: 5786271 (1998-07-01), Ohida et al.
Ohde Tomoshi
Ohsawa Kenji
Nadav Ori
Sony Corporation
Thomas Tom
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