Semiconductor device

Details Semiconductor device Semiconductor device

2005-03-23

2009-10-20

Nguyen, Dao H (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

Reexamination Certificate

active

07605475

ABSTRACT:
The invention reduces outside dimensions of a semiconductor device mounted with a semiconductor die on an external connection medium and minimizes degradation of electrical characteristics of the semiconductor device. The semiconductor device of the invention having a semiconductor die and a lead frame with a plurality of lead terminals has following features. The semiconductor die has a plurality of pad electrodes formed on its front surface, at least one via hole penetrating the semiconductor die, a columnar electrode electrically connected with the pad electrode through the via hole, and a protrusion electrode electrically connected with the columnar electrode. At least one of the lead terminals of the lead frame is formed extending to a position connectable with the protrusion electrode, being connected with the protrusion electrode.

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