Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...

Reexamination Certificate

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Details

C257S676000, C257S678000, C257S694000, C257S696000, C257SE23001

Reexamination Certificate

active

07602052

ABSTRACT:
To prevent a semiconductor device which can be made to be small even though a big-sized chip is used and in which a MOSFET having a low on-resistance can be formed, a semiconductor device according to the invention includes a resin package; at least two main leads that are integrated within the resin package so as to constitute a chip mounting portion; a semiconductor chip mounted on the chip mounting portion; and first and second surface leads each electrically connected to an electrode formed on a surface of the semiconductor chip. The main leads and the first and second surface leads protrude outward along a bottom surface of the resin package, respectively.

REFERENCES:
patent: 5942794 (1999-08-01), Okumura et al.
patent: 6020625 (2000-02-01), Qin et al.
patent: 6175150 (2001-01-01), Ichikawa et al.
patent: 6208023 (2001-03-01), Nakayama et al.
patent: 6242800 (2001-06-01), Munos et al.
patent: 53-132975 (1978-11-01), None
patent: 2001-196518 (2001-07-01), None
patent: 2001-320009 (2001-11-01), None
patent: 2004-247612 (2004-09-01), None
Japanese Notification of Reasons for Refusal, w/ English translation thereof, issued in Japanese Patent Application No. JP 2005-230924 dated Feb. 17, 2009.

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