Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...
Reexamination Certificate
2005-09-14
2009-10-13
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
Small lead frame for connecting a large lead frame to a...
C257S676000, C257S678000, C257S694000, C257S696000, C257SE23001
Reexamination Certificate
active
07602052
ABSTRACT:
To prevent a semiconductor device which can be made to be small even though a big-sized chip is used and in which a MOSFET having a low on-resistance can be formed, a semiconductor device according to the invention includes a resin package; at least two main leads that are integrated within the resin package so as to constitute a chip mounting portion; a semiconductor chip mounted on the chip mounting portion; and first and second surface leads each electrically connected to an electrode formed on a surface of the semiconductor chip. The main leads and the first and second surface leads protrude outward along a bottom surface of the resin package, respectively.
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Japanese Notification of Reasons for Refusal, w/ English translation thereof, issued in Japanese Patent Application No. JP 2005-230924 dated Feb. 17, 2009.
Takano Yoshihiro
Utsunomiya Satoshi
Clark Jasmine J
McDermott Will & Emery LLP
Panasonic Corporation
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