Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2006-08-10
2008-10-07
Clark, S. V (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C257S690000
Reexamination Certificate
active
07432602
ABSTRACT:
A semiconductor device includes: a semiconductor chip connected onto a surface of a printed wiring board in a flip-chip connection; a dam for preventing an outflow of underfill, the dam being provided on the surface of the printed wiring board and surrounding an entire circumference of the semiconductor chip; an external connection terminal for the semiconductor chip, the external connection terminal being provided on the surface of the printed wiring board and arranged outside the dam; a solder resist layer covering the surface of the printed wiring board except for portions for the flip-chip connection and the external connection terminal arrangement; and at least one recess portion being provided in the solder resist layer and within a region between a corner portion of the semiconductor chip and a corner portion of the dam being opposed to the corner portion of the semiconductor chip.
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Clark S. V
Rankin , Hill & Clark LLP
Shinko Electric Industries Co. Ltd.
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