Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Details

C257S670000, C257S676000, C257S787000, C257SE23092

Reexamination Certificate

active

11474659

ABSTRACT:
A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.

REFERENCES:
patent: 6081029 (2000-06-01), Yamaguchi
patent: 6166430 (2000-12-01), Yamaguchi
patent: 6338984 (2002-01-01), Minamio et al.
patent: 6400004 (2002-06-01), Fan et al.
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patent: 6642609 (2003-11-01), Minamio et al.
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patent: 6967396 (2005-11-01), Shibata
patent: 2003/0001249 (2003-01-01), Shimanuki
patent: 11-74440 (1999-03-01), None
patent: P2000-299423 (2000-10-01), None
patent: 2000-307045 (2000-11-01), None
patent: 2001-024133 (2001-01-01), None
patent: P2001-77283 (2001-03-01), None
patent: P2001-189402 (2001-07-01), None
patent: 2001-345413 (2001-12-01), None
patent: WO 99/00826 (1999-01-01), None
patent: WO 01/03186 (2001-01-01), None

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