Semiconductor device

Details Semiconductor device Semiconductor device

1993-09-09

1995-02-28

Ledynh, Bot

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361735, 361736, 174260, 174264, 174 522, 174 524, 257690, 257700, 257777, H05K 100, H01L 2302

Patent

active

053943031

ABSTRACT:
The present invention comprises a semiconductor chip 1, chip electrodes 2 provided on one surface of the semiconductor chip 1, and connected to semiconductor elements formed in the semiconductor chip, a flexible insulating film 3 wrapping the chip electrodes, wiring layers 5 formed in the insulating film 3, and electrically connected to the chip electrodes 2, and terminal electrodes 6 provided on that surface of the insulating film 3 which extends on the upper surface of the chip 1, the electrodes 6 being electrically connected to the wiring layers 5, and functioning as external terminals of the chip 1. Thus, the terminal electrodes 6 are introduced, by means of the wiring layers 5 formed in the insulating film 3, onto that surface of the insulating film 3 which extends on the upper surface of the chip 1.

REFERENCES:
patent: 3039177 (1962-06-01), Burdett
patent: 3467892 (1969-09-01), Sprude et al.
patent: 4628408 (1986-12-01), Kimura
patent: 4833568 (1989-05-01), Berhold
patent: 5289346 (1994-02-01), Carey et al.

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