Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

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Details

257777, 257737, 257738, 257783, H01L 2348, H01L 2352, H01L 2940

Patent

active

058181130

ABSTRACT:
A semiconductor device wherein a sealing resin is filled in a space between an interconnecting wiring board and a semiconductor chip after the semiconductor chip is flip chip-mounted on the wiring board in which at least a non-planar region consisting of a through hole, a concave portion or a convex portion, or a region exhibiting poor wettability to the sealing resin is formed on the surface of the wiring board or the semiconductor chip so as to provide a void in the sealed resin filled between the wiring board and the semiconductor chip for the purpose of minimizing any bad influence from the sealing resin on the interconnecting wirings or elements formed on the semiconductor chip.

REFERENCES:
patent: 3429040 (1969-02-01), Miller
patent: 3577285 (1971-05-01), Rutz
patent: 3621564 (1971-11-01), Tanaka et al.
patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 4710798 (1987-12-01), Marcantonio
patent: 5319237 (1994-06-01), Legros
patent: 5538754 (1996-07-01), Sandock
patent: 5557149 (1996-09-01), Richards et al.
patent: 5629566 (1997-05-01), Doi et al.
IEEE 1994 MTT-S Digest, pp. 1763-1766, TH4E-3, "A Novel Millimeter-Wave IC on Si Substrate Using Flip-Chip Bonding Technology;" H. Sakai et al.; 1994.
Proceedings of the 1995 IEICE General Conference, C-448 "A Flip-Chip Assembly Technology Suitable For Power Amplifier MMIC;" N. Kakimoto et al.; 1995.

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