Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent
1996-09-12
1998-10-06
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
257777, 257737, 257738, 257783, H01L 2348, H01L 2352, H01L 2940
Patent
active
058181130
ABSTRACT:
A semiconductor device wherein a sealing resin is filled in a space between an interconnecting wiring board and a semiconductor chip after the semiconductor chip is flip chip-mounted on the wiring board in which at least a non-planar region consisting of a through hole, a concave portion or a convex portion, or a region exhibiting poor wettability to the sealing resin is formed on the surface of the wiring board or the semiconductor chip so as to provide a void in the sealed resin filled between the wiring board and the semiconductor chip for the purpose of minimizing any bad influence from the sealing resin on the interconnecting wirings or elements formed on the semiconductor chip.
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IEEE 1994 MTT-S Digest, pp. 1763-1766, TH4E-3, "A Novel Millimeter-Wave IC on Si Substrate Using Flip-Chip Bonding Technology;" H. Sakai et al.; 1994.
Proceedings of the 1995 IEICE General Conference, C-448 "A Flip-Chip Assembly Technology Suitable For Power Amplifier MMIC;" N. Kakimoto et al.; 1995.
Iseki Yuji
Shizuki Yasushi
Togasaki Takashi
Yamada Hiroshi
Yoshihara Kunio
Cao Phat X.
Crane Sara W.
Kabushiki Kaisha Toshiba
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