Semiconductor device

Details Semiconductor device Semiconductor device

2007-09-25

2007-09-25

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S787000, C257S784000, C257S778000, C257SE23181

Reexamination Certificate

active

11038465

ABSTRACT:
The present invention relates to semiconductor devices. According to the present invention a semiconductor device is described, comprising: a substrate for carrying a semiconductor chip on a first surface of said substrate; said semiconductor chip being punctually attached to said substrate on said first surface of said substrate via a single attachment point; and means for protecting said semiconductor chip on said first surface of said substrate at least protecting said semiconductor chip laterally.

REFERENCES:
patent: 6429372 (2002-08-01), Taguchi et al.
patent: 6455354 (2002-09-01), Jiang
patent: 6903464 (2005-06-01), Corisis

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