Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-08-15
2006-08-15
Pham, Hoai (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S723000, C257S758000
Reexamination Certificate
active
07091587
ABSTRACT:
An electrode on a main surface of a module board, to which an emitter electrode of a semiconductor chip which includes a switching element of a power supply control circuit that supplies a power supply voltage to amplifier circuit parts of a power module of a digital cellular phone, is electrically connected to a wiring in an internal layer of the module board through a plurality of via holes. Further, the wiring is electrically connected to an electrode for the supply of the power supply voltage, which is provided on a back surface of the module board. Accordingly, an output characteristic of the semiconductor device is improved.
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patent: 6111459 (2000-08-01), Nishijima et al.
patent: 6605999 (2003-08-01), Matsushita et al.
patent: 6804126 (2004-10-01), Lucas
patent: 2002/0044017 (2002-04-01), Suzuki et al.
patent: 2002-111415 (2002-04-01), None
Koyama Kenji
Kyogoku Toshihiko
Miura Toshihiro
Sato Yusuke
Akita Electronics Systems Co., Ltd.
Nguyen Dilinh
Pham Hoai
Renesas Technology Corp.
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