Semiconductor device

Details Semiconductor device Semiconductor device

2006-08-15

2006-08-15

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S276000, C257S625000, C257S707000, C257S712000, C257S713000, C257S717000, C257S719000, C257S720000, C257S796000, C257SE23075, C257SE31131

Reexamination Certificate

active

07091603

ABSTRACT:
In a semiconductor device having semiconductor chips, a lower heat sink which is joined on the principal rear surface side of the semiconductor chips and an upper heat sink which is joined on the principal front surface side of the semiconductor chips, wherein substantially the whole device is encapsulated with a molded resin, the thick-walled portion of a resin lying around a mounted portion is provided with holes which are resin-flow hindering portions for hindering the flow of the resin during the molding thereof, whereby air bubbles are prevented from appearing in the resin within the mounted portion.

REFERENCES:
patent: 5369550 (1994-11-01), Kwon
patent: 5594274 (1997-01-01), Suetaki
patent: 6011312 (2000-01-01), Nakazawa et al.
patent: 6459144 (2002-10-01), Pu et al.
patent: 6693350 (2004-02-01), Teshima et al.
patent: 6960825 (2005-11-01), Mamitsu et al.
patent: 2003/0022464 (2003-01-01), Yutaka et al.
patent: 2003/0122232 (2003-07-01), Shoji et al.
patent: 3-60146 (1991-03-01), None
patent: 4-107931 (1992-04-01), None

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