Semiconductor device

Details Semiconductor device Semiconductor device

2006-02-07

2006-02-07

Trinh, Michael (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

With electrical contact in hole in semiconductor

C257S698000, C438S406000

Reexamination Certificate

active

06995455

ABSTRACT:
Semiconductor device includes a pair of substrates (1, 2) disposed oppositely, semiconductor elements (5, 6) formed in the substrates (1, 2), respectively, and having semiconductor circuits (3, 4) and electrodes (7, 8), respectively, a wiring conductor (9) interposed between the electrodes (7, 8), and a through electrode (12) extending through one substrate (1) and connected to the electrode (7) via the wiring conductor (9). The other substrate (2) is disposed laterally of the through electrode (12). Surface of the through electrode (12) projecting from the one substrate (1) and lateral surface of the element (6) are coated with an insulation material (13). The through electrode (12) has one end exposed in a back surface of the one substrate (1), while other end is positioned flush with a back surface of the other substrate (2), being exposed.

REFERENCES:
patent: 4612083 (1986-09-01), Yasumoto et al.
patent: 4939568 (1990-07-01), Kato et al.
patent: 6087719 (2000-07-01), Tsunashima
patent: 6611052 (2003-08-01), Poo et al.
patent: 2001/0054770 (2001-12-01), Isaak
patent: 06-132474 (1994-05-01), None
patent: 11-307937 (1999-11-01), None

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