Semiconductor device

Details Semiconductor device Semiconductor device

2006-04-18

2006-04-18

Ho, Tu-Tu (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

C257S778000

Reexamination Certificate

active

07030503

ABSTRACT:
Input/output cells are formed so as to be peripherally arranged adjacent to a corner cell on a surface of a semiconductor chip, and electrode pads are formed on the respective input/output cells. The electrode pads are configured in a zigzag pad arrangement so as to form inner and outer pad arrays. However, of the electrode pads forming the inner pad array, those electrode pads in predetermined areas adjacent to the two sides of the corner cell are not disposed, such that an interconnect pattern of a carrier which is bump-bonded to the semiconductor chip and vias are prevented from becoming complex.

REFERENCES:
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patent: 5892276 (1999-04-01), Miki et al.
patent: 5929650 (1999-07-01), Pappert et al.
patent: 6008542 (1999-12-01), Takamori
patent: 6836026 (2004-12-01), Ali et al.
patent: 2003/0230792 (2003-12-01), Wu et al.
patent: P2000-164620 (2000-06-01), None
patent: P2002-252246 (2002-09-01), None

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