Semiconductor device

Details Semiconductor device Semiconductor device

2005-12-27

2005-12-27

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S780000, C257S781000, C257S784000

Reexamination Certificate

active

06979905

ABSTRACT:
In a semiconductor device in which a semiconductor chip is stacked on a substrate, an interposer chip having wirings is provided under the semiconductor chip. A bonding pad of the semiconductor chip is electrically connected to a bonding terminal provided on the substrate via the interposer chip by wire bonding. The interposer chip prevents a semiconductor element formed in the semiconductor chip from deteriorating in terms of an electric property and from being physically damaged. Further, the wire bonding strength does not drop. Moreover, it is possible to form a fine wiring pitch for relaying a wire-bonding wire.

REFERENCES:
patent: 5172212 (1992-12-01), Baba
patent: 5789816 (1998-08-01), Wu
patent: 6057598 (2000-05-01), Payne et al.
patent: 6407456 (2002-06-01), Ball
patent: 6476500 (2002-11-01), Kimura
patent: 2001/0020735 (2001-09-01), Chikawa et al.
patent: 2002/0140110 (2002-10-01), Takahashi et al.
patent: 2003/0222339 (2003-12-01), Hirai
patent: 76250/2002 (2001-03-01), None
patent: 562240 (2005-04-01), None
European Search Report mailed Apr. 2, 2004 in corresponding EP Appln. No. 04001610.7.

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