Semiconductor device

Details Semiconductor device Semiconductor device

2005-08-16

2005-08-16

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S203000, C257S208000, C257S786000

Reexamination Certificate

active

06930380

ABSTRACT:
A semiconductor device includes a semiconductor chip, a plurality of bonding pads which are formed on a main surface of the semiconductor chip and include first power source bonding pads, second power source bonding pads and a plurality of signal bonding pads, a plurality of leads which are arranged around the semiconductor chip and include first power source leads and a plurality of signal leads, a plurality of bonding wires which include first bonding wires for connecting the first power source bonding pads with the first power source leads, second bonding wires for connecting the first bonding pads with second bonding pads and third bonding wires for connecting the plurality of signal bonding pads with the plurality of signal leads, and a sealing body which seals the semiconductor chip, the plurality of bonding wires and some of the plurality of leads.

REFERENCES:
patent: 5401989 (1995-03-01), Kikuchi
patent: 1 205 974 (2001-06-01), None
patent: 63-44734 (1988-02-01), None
patent: 63-78549 (1988-04-01), None
patent: 3-145153 (1991-06-01), None
patent: 6-283604 (1994-10-01), None
patent: 11-233636 (1999-08-01), None

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