Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

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Details

257669, 257675, 257796, H01L 23495

Patent

active

058148787

ABSTRACT:
A semiconductor device including a plurality of grooves (21) formed on a top surface of a heat sink (51). A sealing resin (2) fills a portion between a lead frame (5) provided facing the top surface and the heat sink (51). The grooves (21) are formed on both sides of a center region (22) extending so as to divide the top surface in two. A power semiconductor element (11) is disposed above the center region (22) and a controlling semiconductor element (16) controlling the power semiconductor element (11) is disposed above the region where the grooves (21) are formed. The above construction suppresses thermal resistance interposed in a path through which heat loss in the power semiconductor element (11) is radiated to the heat sink (51) and improves heat radiating efficiency while maintaining close contact between the sealing resin (2) and the heat sink (51).

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patent: 5430331 (1995-07-01), Hamzehdoost et al.
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patent: 5489801 (1996-02-01), Blish, II
patent: 5530295 (1996-06-01), Mehr
patent: 5641987 (1997-06-01), Lee
patent: 5646831 (1997-07-01), Manteghi
patent: 5652461 (1997-07-01), Ootsuki et al.
patent: 5652463 (1997-07-01), Weber et al.
patent: 5666003 (1997-09-01), Shibata et al.

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