Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Patent
1996-06-17
1998-09-29
Ostrowski, David
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With dam or vent for encapsulant
257669, 257675, 257796, H01L 23495
Patent
active
058148787
ABSTRACT:
A semiconductor device including a plurality of grooves (21) formed on a top surface of a heat sink (51). A sealing resin (2) fills a portion between a lead frame (5) provided facing the top surface and the heat sink (51). The grooves (21) are formed on both sides of a center region (22) extending so as to divide the top surface in two. A power semiconductor element (11) is disposed above the center region (22) and a controlling semiconductor element (16) controlling the power semiconductor element (11) is disposed above the region where the grooves (21) are formed. The above construction suppresses thermal resistance interposed in a path through which heat loss in the power semiconductor element (11) is radiated to the heat sink (51) and improves heat radiating efficiency while maintaining close contact between the sealing resin (2) and the heat sink (51).
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Hirakawa Satoshi
Takao Haruo
Mitsubishi Denki & Kabushiki Kaisha
Ostrowski David
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