Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Specified wide band gap semiconductor material other than... – Diamond or silicon carbide

Reexamination Certificate

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C257S136000, C257S330000

Reexamination Certificate

active

06917054

ABSTRACT:
A semiconductor device includes a trench formed on a source side of a drift region, a p-type gate region and a gate formed at the bottom of the trench, and the source formed over the entire surface of the unit device through an insulating film. The narrowest portion of a channel of the device is deeper than one-half the junction depth of the p-type gate region. This allows the width of the channel on the drain side to be reduced even when a lower energy ion implantation manufacturing process is used.

REFERENCES:
patent: 5396085 (1995-03-01), Baliga
patent: 5747831 (1998-05-01), Loose et al.
patent: 5753938 (1998-05-01), Thapar et al.
patent: 5945701 (1999-08-01), Siergiej et al.
patent: 6380569 (2002-04-01), Chang et al.
patent: 6617653 (2003-09-01), Yokogawa et al.
patent: 6767783 (2004-07-01), Casady et al.
patent: 2001-094120 (2001-04-01), None

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