Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Patent

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Details

257737, 257787, H01L 2348

Patent

active

061076899

ABSTRACT:
A semiconductor device according to the present invention includes a wiring substrate having a chip mounting face on which a connected portion is formed, a semiconductor chip having an element forming face on which externally connecting terminals are formed, the externally connecting terminals being electrically connected to the connected portion, and a resin-sealed layer formed between the wiring substrate and the semiconductor chip so as to cover at least a periphery of the semiconductor chip. The wiring substrate has a through hole bored from the chip mounting face to an undersurface thereof. Part of the through hole is formed outside a chip mounting region of the wiring substrate.

REFERENCES:
patent: 5350947 (1994-09-01), Takekawa et al.
patent: 5543663 (1996-08-01), Takubo
patent: 5760465 (1998-06-01), Alcoe et al.

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