1989-11-22
1991-11-05
LaRoche, Eugene R.
357 73, 357 74, 357 79, H01L 7302
Patent
active
050634356
ABSTRACT:
The present invention relates to a semiconductor casing which permits transmitting ultraviolet rays to a semiconductor chip within the casing. The semiconductor casing includes the substrate formed by a thin metal plate for mounting the semiconductor chip, a ceramic frame fixed to the periphery of the substrate, a ceramic cap which covers the semiconductor chip, is mounted on the ceramic frame and allows transmission of ultraviolet rays, and leads which are sandwiched between the ceramic frame and the ceramic cap to allow the electrical connection of the semiconductor chip.
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Patent Abstracts of Japan, vol. 5, No. 91 (E-61) [763], 13th Jun. 1981; & JP-A-56 37656 (Nippon Denki), 11-04-1981.
Patent Abstracts of Japan, vol. 10, No. 317 (E-449) [2373], 28th Oct. 1986; & JP-A-61 127 155 (Sumitomo Electric Indu. Ltd.), 14-06-1986.
Patent Abstracts of Japan, vol. 8, No. 127 (E-250) [1564], 14th Jun. 1984; & JP-A-59 36947 (Mitsubishi Denki K.K.), 29-02-1984.
Bonkohara Manabu
Nishino Seiichi
Okamoto Satoru
Terazi Kazufumi
LaRoche Eugene R.
NEC Corporation
Ratliff R.
Sumitomo Electric Industries Ltd.
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