Semiconductor cooling module

Details Semiconductor cooling module Semiconductor cooling module

1990-05-22

1991-07-02

Hille, Rolf

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 81, 361382, 361385, 165 804, 16510433, H01L 2302, H01L 2504

Patent

active

050289896

ABSTRACT:
A plurality of semiconductor elements are mounted on a substrate. A plurality of cooling elements are inserted between a thermal conductor for conducting a heat generated from the semiconductor elements to a cooling medium and the semiconductor elements. A channel for conducting the generated heat of the semiconductor elements to the cooling medium is provided near the cooling elements and between the thermal conductor and a channel plate mounted on the thermal conductor.

REFERENCES:
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patent: 3977605 (1976-08-01), Sheldon
patent: 3993123 (1976-11-01), Chu et al.
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patent: 4193445 (1980-03-01), Chu et al.
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patent: 4349154 (1982-09-01), Pacht
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patent: 4697739 (1987-10-01), McCraoken et al.
patent: 4908695 (1990-03-01), Morihara et al.
patent: 4925096 (1990-05-01), Gill
IBM Tech. Disclosure, "Designs for Providing Thermal Interface Material . . . ," R. C. Chu, vol. 20, No. 7, 12/77, p. 2761.

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