Heat exchange – With valve or movable deflector for heat exchange fluid flow – With by-pass of heat exchanger or heat exchanger section
Patent
1988-10-24
1990-12-11
James, Andrew J.
Heat exchange
With valve or movable deflector for heat exchange fluid flow
With by-pass of heat exchanger or heat exchanger section
357 80, 357 75, 165 804, 16510433, 361382, H01L 2504, H01L 3902, H01L 2316
Patent
active
049774441
ABSTRACT:
Flexible cooling paths are connected to semiconductor elements which are heated members. A cooling apparatus comprises cooling blocks connected to cooling blocks, coolant flow paths through which the coolant flows, coolant branching mechanisms provided in the coolant flow paths and connecting mechanism for connecting the branching mechanism and the cooling blocks through O-rings. A part of coolant flowing through the cooling flow paths is introduced into the cooling blocks for the respective heated chips in order.
REFERENCES:
patent: 3703668 (1972-11-01), Bylund et al.
patent: 4129881 (1978-12-01), Reichel et al.
patent: 4644385 (1987-02-01), Nakanishi et al.
patent: 4686606 (1987-08-01), Yamada et al.
patent: 4740866 (1988-04-01), Kajiwara et al.
Integrated Circuit Module Package Cooling Structure IBM Bull., vol. 20, No. 10, Mar. 1978, pp. 3898-3899.
Kasai Kenichi
Kobayashi Satomi
Kuwahara Heikichi
Nakajima Tadakatsu
Ohashi Shigeo
Hitachi , Ltd.
James Andrew J.
Ostrowski D. M.
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