Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Patent
1997-02-27
1998-10-13
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With stress relief
257670, 257680, 257696, 257692, 257698, 257666, 174261, H05K 102
Patent
active
058216090
ABSTRACT:
A semiconductor chip connection component having numerous leads extending side-by-side across a gap in a support structure, each lead having a frangible section to permit detachment of one end of the lead from the support structure in a bonding process. The frangible sections are formed by treating the lead-forming material in an elongated treatment zone extending across the regions occupied by numerous leads. The process avoids the need for especially fine etching to form notches in the lateral edges of the leads.
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DiStefano Thomas H.
Fjelstad Joseph
Karavakis Konstantine
Smith John W.
Tessera Inc.
Thomas Tom
Williams Alexander Oscar
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