Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having schottky gate
Reexamination Certificate
2010-08-25
2011-12-06
Mitchell, James (Department: 2813)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having schottky gate
C438S108000, C438S190000
Reexamination Certificate
active
08071433
ABSTRACT:
A semiconductor component including: a substrate, at least one semiconductor chip arranged on the substrate and at least one passive device likewise arranged on the substrate. The passive device is mounted with its underside on the substrate. The semiconductor component further includes an interspace disposed between the underside of the passive device and the substrate. The interspace is filled with an underfilling material. In order to avoid the solder pumping effect, the upper side and the lateral sides of the passive device are also embedded in a plastic compound.
REFERENCES:
patent: 3585468 (1971-06-01), Chertok et al.
patent: 6018192 (2000-01-01), Root et al.
patent: 6108210 (2000-08-01), Chung
patent: 6291267 (2001-09-01), Dore et al.
patent: 6313521 (2001-11-01), Baba
patent: 6351032 (2002-02-01), Lee et al.
patent: 6392289 (2002-05-01), Tandy
patent: 6407461 (2002-06-01), Farquhar et al.
patent: 6546620 (2003-04-01), Juskey et al.
patent: 6632704 (2003-10-01), Kumamoto et al.
patent: 6867486 (2005-03-01), Hong
patent: 6888259 (2005-05-01), Ishikawa et al.
patent: 6946601 (2005-09-01), Lee et al.
patent: 7015591 (2006-03-01), Lee
patent: 7087455 (2006-08-01), Fukuda et al.
patent: 7109524 (2006-09-01), Killer
patent: 7109592 (2006-09-01), Fortin et al.
patent: 7279771 (2007-10-01), Sunohara et al.
patent: 2002/0074669 (2002-06-01), Watanabe et al.
patent: 2002/0108768 (2002-08-01), Jimarez et al.
patent: 2002/0140085 (2002-10-01), Lee et al.
patent: 2002/0173074 (2002-11-01), Chun-Jen et al.
patent: 2003/0080437 (2003-05-01), Gonzalez et al.
patent: 2003/0201548 (2003-10-01), Ikezawa et al.
patent: 2004/0036162 (2004-02-01), Chuang et al.
patent: 2004/0113284 (2004-06-01), Zhao et al.
patent: 2004/0180469 (2004-09-01), Fortin et al.
patent: 2004/0227258 (2004-11-01), Nakatani
patent: 2004/0240146 (2004-12-01), Kayatani et al.
patent: 2004/0262782 (2004-12-01), Ellis et al.
patent: 2005/0017373 (2005-01-01), Nishikawa et al.
patent: 2005/0121806 (2005-06-01), Sangiorgi
patent: 2006/0103030 (2006-05-01), Aoki et al.
patent: 2006/0158863 (2006-07-01), Hsu
patent: 2007/0087471 (2007-04-01), Yang et al.
patent: 2008/0237890 (2008-10-01), Tago
Gruendler Gerold
Hoegerl Juergen
Killer Thomas
Strutz Volker
Syri Erich
Edell Shapiro & Finnan LLC
Infineon - Technologies AG
Mitchell James
LandOfFree
Semiconductor component with surface mountable devices and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor component with surface mountable devices and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor component with surface mountable devices and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4260160