Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1976-06-04
1978-01-24
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29580, 29590, 148187, 156659, 156662, 357 55, 427 88, H01L 21312
Patent
active
040702308
ABSTRACT:
A semiconductor component of a semiconductor or circuit system is provided. The circuit incorporates a dielectric carrier comprised of synthetic material. The circuit is provided with plate-shaped semiconductor islands. The islands possess doping layers and are interconnected as desired with a thin film wiring. A process for the production of such product is also provided.
REFERENCES:
patent: 3616345 (1971-10-01), Van Dijk
patent: 4001870 (1977-01-01), Saiki et al.
Friedman Stuart J.
Powell William A.
Siemens Aktiengesellschaft
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