Semiconductor component with dielectric carrier and its manufact

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

29580, 29590, 148187, 156659, 156662, 357 55, 427 88, H01L 21312

Patent

active

040702308

ABSTRACT:
A semiconductor component of a semiconductor or circuit system is provided. The circuit incorporates a dielectric carrier comprised of synthetic material. The circuit is provided with plate-shaped semiconductor islands. The islands possess doping layers and are interconnected as desired with a thin film wiring. A process for the production of such product is also provided.

REFERENCES:
patent: 3616345 (1971-10-01), Van Dijk
patent: 4001870 (1977-01-01), Saiki et al.

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