Semiconductor component with a disc-shaped case

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Details

357 74, H01L 21447, H01L 21603, H01L 2310

Patent

active

045675040

ABSTRACT:
Semiconductor component with a disc-shaped case, including a ceramic ring having an inner surface, two metal discs, metal rings connecting the metal discs to the ceramic ring, a semiconductor body disposed in the case between the metal discs, an additional metal ring fastened to the periphery of each of the metal discs within the case, at least one electrically and thermally insulating foil having a high energy of evaporation disposed between the semiconductor body and the ceramic ring covering the inner surface of the ceramic ring and overlapping the additional metal rings.

REFERENCES:
patent: 4063348 (1977-12-01), Borden et al.
patent: 4099201 (1978-07-01), Mueller
patent: 4141030 (1979-02-01), Eisele et al.
patent: 4150394 (1979-04-01), Sugawa et al.
patent: 4162514 (1979-07-01), DeBruyne et al.
patent: 4240099 (1980-12-01), Brandt et al.
patent: 4274106 (1981-06-01), Ohdate
patent: 4399452 (1983-08-01), Nakashima et al.

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