Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate
2008-06-03
2008-06-03
Lewis, Monica (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
C257S690000, C257S738000, C257S774000, C257S780000, C257S781000, C257S788000, C257S790000
Reexamination Certificate
active
07382060
ABSTRACT:
A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the component includes the steps of providing a substrate containing multiple dice, forming trenches on the substrate proximate to peripheral edges of the dice, and depositing a polymer material into the trenches. In addition, the method includes the steps of planarizing the back side of the substrate to contact the polymer filled trenches, and cutting through the polymer trenches to singulate the components from the substrate. Prior to the singulating step the components can be tested and burned-in while they remain on the substrate.
REFERENCES:
patent: 5138434 (1992-08-01), Wood et al.
patent: 5436203 (1995-07-01), Lin
patent: 5496775 (1996-03-01), Brooks
patent: 5607875 (1997-03-01), Nishizawa et al.
patent: 5618752 (1997-04-01), Gaul
patent: 5686317 (1997-11-01), Akram et al.
patent: 5789307 (1998-08-01), Igel et al.
patent: 5851911 (1998-12-01), Farnworth
patent: 5863813 (1999-01-01), Dando
patent: 5888883 (1999-03-01), Sasaki et al.
patent: 5897337 (1999-04-01), Kata et al.
patent: 5904546 (1999-05-01), Wood et al.
patent: 5952716 (1999-09-01), Dibble et al.
patent: 6013534 (2000-01-01), Mountain
patent: 6013948 (2000-01-01), Akram et al.
patent: 6020217 (2000-02-01), Kuisi et al.
patent: 6051875 (2000-04-01), Dando
patent: 6054772 (2000-04-01), Mostafazadeh et al.
patent: 6060373 (2000-05-01), Saitoh
patent: 6074896 (2000-06-01), Dando
patent: 6080602 (2000-06-01), Tani et al.
patent: 6087845 (2000-07-01), Wood et al.
patent: 6107109 (2000-08-01), Akram et al.
patent: 6107164 (2000-08-01), Ohuchi
patent: 6114240 (2000-09-01), Akram et al.
patent: 6130111 (2000-10-01), Ikuina et al.
patent: 6136137 (2000-10-01), Farnworth et al.
patent: 6150717 (2000-11-01), Wood et al.
patent: 6153448 (2000-11-01), Takahashi et al.
patent: 6169329 (2001-01-01), Farnworth et al.
patent: 6177295 (2001-01-01), De Samber et al.
patent: 6180504 (2001-01-01), Farnworth et al.
patent: 6221751 (2001-04-01), Chen et al.
patent: 6228678 (2001-05-01), Gilleo et al.
patent: 6233185 (2001-05-01), Beffa et al.
patent: 6281131 (2001-08-01), Gilton et al.
patent: 6294837 (2001-09-01), Akram et al.
patent: 6313531 (2001-11-01), Geusic et al.
patent: 6326698 (2001-12-01), Akram
patent: 6338980 (2002-01-01), Satoh
patent: 6350664 (2002-02-01), Haji et al.
patent: 6353267 (2002-03-01), Ohuchi et al.
patent: 6451624 (2002-09-01), Farnworth et al.
patent: 6524890 (2003-02-01), Ueda et al.
patent: 6534387 (2003-03-01), Shinogi et al.
patent: 6544821 (2003-04-01), Akram
patent: 6544902 (2003-04-01), Farnworth
patent: 6549821 (2003-04-01), Farnworth et al.
patent: 6573156 (2003-06-01), Wang et al.
patent: 6579748 (2003-06-01), Okuno et al.
patent: 6607970 (2003-08-01), Wakabayashi
patent: 6620731 (2003-09-01), Farnworth et al.
patent: 6649445 (2003-11-01), Qi et al.
patent: 6717245 (2004-04-01), Kinsman et al.
patent: 6774659 (2004-08-01), Chiang
patent: 6809421 (2004-10-01), Hayasaka et al.
patent: 6833613 (2004-12-01), Akram et al.
patent: 6841413 (2005-01-01), Liu et al.
patent: 6908784 (2005-06-01), Farnworth et al.
patent: 6952054 (2005-10-01), Akram et al.
patent: 6998344 (2006-02-01), Akram et al.
patent: 7029949 (2006-04-01), Farnworth et al.
patent: 2001/0040117 (2001-11-01), Easton
patent: 2002/0009826 (2002-01-01), Chien
patent: 2002/0097302 (2002-07-01), Nikkel
patent: 2004/0182733 (2004-09-01), Dunlap
patent: 2005/0168908 (2005-08-01), Maeda et al.
patent: 2006/0118953 (2006-06-01), Farnworth et al.
patent: 19758569 (1999-10-01), None
Advanced Coating Parylene Conformal Coating Specialists, advertising material, pp. 1-7, 1998.
Dexter Electronic Materials, Hysol FP 4451 Material Properties, spec sheet, pp. 1-2, Aug. 20, 1999.
Dexter Electronic Materials, Hysol FP 4450 Material Properties, spec sheet, pp. 1-2, Aug. 20, 1999.
Parylene Coating, advertising for Specialty Coating Systems, pp. 1-2, date unknown.
“Wafer size CSP Packaging by VPES”, Japan Rec Co., Ltd., advertising material, pp. 1-4, 1998.
David Francis & Linda Jardine, “Thin, Wafer-Level Package Is Made Without Damaging Die”, Chip Scale Review, May/Jun. 2002, p. 70.
Jeffrey C. Demmin, “More Wafer Thinning at ICAPS”, media news analysis, Mar. 13, 2002.
Peter Van Zant, Microchip Fabrication, 2000, McGraw-Hill, Fourth Edition, p. 588.
Timothy Ferguson et al, Moisture Absorption in No-Flow Underfill Materials and its Effect on Interfacial Adhesion to Solder Mask Coated FR4 Printed Wiring Board, 2001, 2001 International Symposium on Advanced Packaging Materials, pp. 327-332.
Charles A. Harper, Electronic Packaging and Interconnection Handbook, 2000, Third Edition, McGraw-Hill, pp. 1.7 and 1.8.
Doan Trung Tri
Farnworth Warren M.
Wood Alan G.
Gratton Stephen A.
Lewis Monica
Micro)n Technology, Inc.
LandOfFree
Semiconductor component having thinned die, polymer layers,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor component having thinned die, polymer layers,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor component having thinned die, polymer layers,... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2814491