Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Reexamination Certificate
2007-05-17
2010-06-15
Nguyen, Thinh T (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Test or calibration structure
C257S673000, C257S780000, C438S014000, C438S018000
Reexamination Certificate
active
07737439
ABSTRACT:
A semiconductor component having test pads and a method and apparatus for testing the same is described. In an example, an un-bumped substrate is obtained having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. In another example, a substrate is fabricated having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. An insulating layer is formed over the plurality of test pads.
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U.S. Appl. No. 11/804,496, filed May 17, 2007, Mohsen H. Mardi, XILINX, Inc., 2100 Logic Drive, San Jose, California 95124.
Bazargan Hassan K.
Cho Jae
Liang Shih-Liang
Mardi Mohsen Hossein
Stokes Sanjiv
Brush Robert M.
King John J.
Nguyen Thinh T
XILINX Inc.
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