Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2006-07-04
2006-07-04
Clark, S. V. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S786000
Reexamination Certificate
active
07071571
ABSTRACT:
The invention relates to a semiconductor component having a plastic housing which encloses a rewiring structure which has flat conductors embedded in plastic. The flat conductors are formed either by a slotted metal sheet or by elongated contact connecting pads. Arranged on the contact connecting pads are flip-chip contacts of a semiconductor chip within the plastic housing, while external contact pads are connected to the flip-chip contacts via flat conductors or to the semiconductor chip via elongated contact connecting pads.
REFERENCES:
patent: 4383270 (1983-05-01), Schelhorn
patent: 5434452 (1995-07-01), Higgins, III
patent: 5550402 (1996-08-01), Nicklaus
patent: 5877559 (1999-03-01), Takayama et al.
patent: 6090263 (2000-07-01), Abys et al.
patent: 6157084 (2000-12-01), Hino et al.
patent: 6340606 (2002-01-01), Hashimoto
patent: 6395633 (2002-05-01), Cheng et al.
patent: 6538209 (2003-03-01), Ouchi et al.
patent: 6555021 (2003-04-01), Vaddi et al.
patent: 6753612 (2004-06-01), Adae-Amoakoh et al.
patent: 6847111 (2005-01-01), Yang et al.
patent: 101 29 387 (2003-01-01), None
patent: 102 35 332 (2004-02-01), None
patent: 0 592 094 (1999-02-01), None
patent: 0 967 649 (1999-12-01), None
patent: 0 811 706 (2001-06-01), None
patent: 1 271 644 (2003-01-01), None
patent: 0480644 (2002-03-01), None
Dangelmaier Jochen
Theuss Horst
Clark S. V.
Dicke, Billiq & Czaja, PLLC
Infineon Technoloiges AG
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