Semiconductor component having a CSP housing

Details Semiconductor component having a CSP housing Semiconductor component having a CSP housing

2007-09-25

2007-09-25

Parker, Kenneth (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257SE23126, C257S678000, C257S685000, C257S780000, C257S781000, C361S749000, C361S760000, C174S050510

Reexamination Certificate

active

11061762

ABSTRACT:
The invention relates to a semiconductor component for mounting on a printed circuit board. The semiconductor component includes a housing that at least partially surrounds at least one flat semiconductor chip. Electrical contacts are assigned to the semiconductor chip and serve to establish an electrical connection to electrodes provided on a printed circuit board. The flat semiconductor chip has a mounting lateral surface that includes contact surfaces configured to make contact with the electrical contacts. A buffer layer is located between the housing and the chip, and surrounds the chip up to a supporting surface located on the mounting lateral surface.

REFERENCES:
patent: 5394303 (1995-02-01), Yamaji
patent: 5736780 (1998-04-01), Murayama
patent: 5783870 (1998-07-01), Mostafazadeh et al.
patent: 5805422 (1998-09-01), Otake et al.
patent: 5920118 (1999-07-01), Kong
patent: 5977621 (1999-11-01), Stuck
patent: 6014316 (2000-01-01), Eide
patent: 6150719 (2000-11-01), Saia et al.
patent: 6313532 (2001-11-01), Shimoishizaka et al.
patent: 6326700 (2001-12-01), Bai et al.
patent: 6329708 (2001-12-01), Komiyama
patent: 6333564 (2001-12-01), Katoh et al.
patent: 6376769 (2002-04-01), Chung
patent: 6388322 (2002-05-01), Goossen et al.
patent: 6389689 (2002-05-01), Heo
patent: 6440722 (2002-08-01), Knapp et al.
patent: 6560117 (2003-05-01), Moon
patent: 6646335 (2003-11-01), Emoto
patent: 6710437 (2004-03-01), Takahashi et al.
patent: 6724076 (2004-04-01), Kahlisch et al.
patent: 6768191 (2004-07-01), Wennemuth et al.
patent: 6876074 (2005-04-01), Kim
patent: 6998704 (2006-02-01), Yamazaki et al.
patent: 2002/0027298 (2002-03-01), Sakamoto et al.
patent: 2002/0034872 (2002-03-01), Kazama et al.
patent: 2002/0038890 (2002-04-01), Ohuchi
patent: 2003/0067755 (2003-04-01), Haimerl et al.
patent: 19803020 (1999-09-01), None
patent: 19954888 (2001-05-01), None
patent: 10016132 (2001-10-01), None
patent: 10133361 (2003-01-01), None
patent: 0810655 (1997-12-01), None
patent: 0875932 (1998-11-01), None
patent: 1067601 (2001-01-01), None
patent: 2001-210760 (2001-08-01), None
patent: 2001-237351 (2001-08-01), None
patent: WO-03/007364 (2003-01-01), None

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