Semiconductor component comprising flip chip contacts with...

Details Semiconductor component comprising flip chip contacts with... Semiconductor component comprising flip chip contacts with...

2007-01-08

2008-12-09

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257SE23021, C257SE23008, C257SE21503, C257SE23004, C257SE23069, C257S734000, C257S737000, C257S738000, C257S692000, C257S693000, C257S772000, C257S779000, C438S108000

Reexamination Certificate

active

07462940

ABSTRACT:
A semiconductor component includes flip-chip contacts arranged on a wiring structure of a semiconductor chip. The wiring structure includes at least one metallization layer and at least one dielectric insulation layer made of a low-k material with a relative permittivity εrlower than the relative permittivity of a silicon dioxide. The flip-chip contacts are arranged on contact areas of an upper metallization layer and have a polymer core surrounded by a lead-free solder sheath.

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