Semiconductor component comprising a surface metallization

Details Semiconductor component comprising a surface metallization Semiconductor component comprising a surface metallization

2006-09-19

2006-09-19

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

C257S692000, C257S784000

Reexamination Certificate

active

07109590

ABSTRACT:
The invention relates to a semiconductor component comprising surface metallization and having at least one semiconductor body (3) and a package base body (2) on whose surface conductor path structures (7) are formed by means of surface metallization. A subregion of the conductor path structure (7) constitutes the solder connections of the semiconductor component. The solder connections (1) are combined to form rows, the individual rows of solder connections being arranged at a very small, predetermined spacing from one another.

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