Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2007-01-03
2010-12-14
Vu, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S678000, C257S690000, C257S734000, C257SE23055, C257SE21503
Reexamination Certificate
active
07851927
ABSTRACT:
A semiconductor component (1) has a semiconductor chip (5) and a semiconductor component carrier (3) with external connection strips (12, 13, 15). The semiconductor chip (5) has a first electrode (6) and a control electrode (7) on its top side (8) and a second electrode (9) on its rear side (10). The semiconductor chip (5) is fixed by its top side (8) in flip-chip arrangement (11) on a first and a second external connection strip (12, 13) for the first electrode (6) and the control electrode (7). The second electrode (9) is electrically connected to at least one third external connection strip (15) via a bonding tape (14).
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First Examination Report for DE102006060484.9-32, dated Nov. 1, 2007.
Hosseini Khalil
Koenigsberger Alexander
Otremba Ralf
Schiess Klaus
Banner & Witcoff , Ltd.
Chi Suberr
Infineon - Technologies AG
Vu David
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