Semiconductor component and method of manufacturing same

Details Semiconductor component and method of manufacturing same Semiconductor component and method of manufacturing same

2003-04-15

2004-01-27

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S672000, C257S684000, C257S704000

Reexamination Certificate

active

06683370

ABSTRACT:

FIELD OF THE INVENTION
This invention relates generally to semiconductor components, and relates more particularly to semiconductor components having a plurality of electronic chips.
BACKGROUND OF THE INVENTION
With the increased market demand for smaller semiconductor components and with the growth of the sensor market, there is a need for packaged sensor chips having increased accuracy and functionality. Accordingly, integrated circuits and sensors have been combined onto a single printed circuit board (PCB). However, in certain applications it is desirable to have the sensor chip separate from the integrated circuit chip for reasons of functionality, reliability, safety, and/or manufacturability. Communication between the integrated circuit and the sensor, and between the integrated circuit and other components of the package, has traditionally been provided via electrically-conducting traces placed on the PCB. This method consumes significant area on the PCB, and requires numerous solder connections for each component. Accordingly, a need exists for a multi-chip semiconductor component assembled in a single, discrete, leadless package platform, having increased sensor functionality and accuracy as well as decreased component handling, PCB size, and solder connection requirements.


REFERENCES:
patent: 5309460 (1994-05-01), Fujimaki et al.
patent: 5355016 (1994-10-01), Swirbel et al.
patent: 5489800 (1996-02-01), Brown et al.
patent: 5874784 (1999-02-01), Aoki et al.
patent: 5918112 (1999-06-01), Shah et al.
patent: 6166430 (2000-12-01), Yamaguchi
patent: 6177723 (2001-01-01), Eng et al.
patent: 6424024 (2002-07-01), Shih et al.
patent: 6444563 (2002-09-01), Potter et al.
patent: 6476486 (2002-11-01), Humphrey et al.
patent: 6498392 (2002-12-01), Azuma
patent: 6583499 (2003-06-01), Huang et al.
patent: 2001/0007780 (2001-07-01), Minamio et al.
patent: 2002/0024127 (2002-02-01), Sakuraba et al.
patent: 2002/0185713 (2002-12-01), Nakae
patent: 2003/0178711 (2003-09-01), Honda et al.
patent: 62-22468 (1987-01-01), None

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