Semiconductor component and method of manufacture

Details Semiconductor component and method of manufacture Semiconductor component and method of manufacture

1998-06-01

2000-07-25

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438106, 438110, H01L 2144, H01L 2148, H01L 2150

Patent

active

060935839

ABSTRACT:
A method of manufacturing a semiconductor component includes applying an encapsulant (211) to a wafer (210, 430), degassing the encapsulant (211), and separating the wafer (210, 430) into a plurality of semiconductor components. Manufactured in this manner, the encapsulant (211) of the semiconductor component is substantially devoid of air bubbles and voids.

REFERENCES:
patent: 5348913 (1994-09-01), McBride et al.
patent: 5413955 (1995-05-01), Lee et al.
patent: 5557149 (1996-09-01), Richards et al.
patent: 5721162 (1998-02-01), Schubert et al.

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