Semiconductor component and method of manufacture

Details Semiconductor component and method of manufacture Semiconductor component and method of manufacture

2005-08-30

2005-08-30

Clark, Jasmine (Department: 2815)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S106000, C257S704000, C257S706000, C257S713000, C257S724000

Reexamination Certificate

active

06936501

ABSTRACT:
A semiconductor component having a lid for protecting a semiconductor chip and a method for manufacturing the semiconductor component. The semiconductor chip has an active surface and a mounting surface. It is flip-chip mounted to a support substrate so the active surface is adjacent the support substrate. A passive or active circuit element may be mounted to the support substrate. The mounting surface of the semiconductor chip has a radius of curvature. A thermal interface material is dispensed on the mounting surface of the semiconductor chip. A lid is coupled to the support substrate via a lid adhesive. A portion of the lid has a radius of curvature that corresponds to the radius of curvature of the semiconductor chip. A force is applied to the lid so that it contacts the thermal interface material and urges the interface material to the sides of the semiconductor chip. The force causes wetting of the thermal interface material.

REFERENCES:
patent: 5723904 (1998-03-01), Shiga
patent: 5907474 (1999-05-01), Dolbear
patent: 5926371 (1999-07-01), Dolbear
patent: 6392143 (2002-05-01), Koshio
patent: 6392145 (2002-05-01), Andric
patent: 6504243 (2003-01-01), Andric et al.
patent: 6558977 (2003-05-01), Nakaoka et al.
patent: 2004/0099958 (2004-05-01), Schildgen et al.

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