Semiconductor circuit with multiple contact sizes

Details Semiconductor circuit with multiple contact sizes Semiconductor circuit with multiple contact sizes

2006-08-01

2006-08-01

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S691000, C257S693000, C257S775000, C438S613000

Reexamination Certificate

active

07084500

ABSTRACT:
A semiconductor circuit comprising a semiconductor die and a package substrate. In one embodiment, a first plurality of conductive bumps serves as a portion of a conductive path between contacts on the semiconductor die and contacts on the package substrate. A second plurality of conductive bumps serves as a portion of a conductive path between other contacts on the die and contacts on the package substrate. Each of the bumps in the first plurality of conductive bumps is larger than each of the bumps in the second plurality of conductive bumps. In another embodiment, the average size of the first plurality of conductive bumps may be at least 20% larger (or greater) than the average size of the second plurality of bumps.

REFERENCES:
patent: 4764804 (1988-08-01), Sahara et al.
patent: 5214308 (1993-05-01), Nishiguchi et al.
patent: 5291062 (1994-03-01), Higgina III
patent: 5569960 (1996-10-01), Kumazawa et al.
patent: 5642261 (1997-06-01), Bond et al.
patent: 5672542 (1997-09-01), Schwiebert et al.
patent: 5751060 (1998-05-01), Laine et al.
patent: 5798567 (1998-08-01), Kelly et al.
patent: 5991156 (1999-11-01), Bond et al.
patent: 6011694 (2000-01-01), Hirakawa
patent: 6222277 (2001-04-01), Downes
patent: 6255699 (2001-07-01), Bracchitta et al.
patent: 6316822 (2001-11-01), Venkateshwaran et al.
patent: 6410861 (2002-06-01), Huang et al.
patent: 6563712 (2003-05-01), Akram et al.
patent: 6580169 (2003-06-01), Sakuyama et al.
patent: 6780023 (2004-08-01), Miyagawa
U.S. Appl. No. 10/453,445, Swanson et al. filed Jun. 3, 2003 “Semiconductor Circuit with Multiple Contact Sizes”.

Affiliated with

Also associated with

Rating

Semiconductor circuit with multiple contact sizes does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor circuit with multiple contact sizes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor circuit with multiple contact sizes will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3685820