Semiconductor device manufacturing: process – Semiconductor substrate dicing – With attachment to temporary support or carrier
Reexamination Certificate
2006-07-11
2006-07-11
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
With attachment to temporary support or carrier
C438S067000, C438S068000, C438S107000, C438S455000, C438S458000
Reexamination Certificate
active
07074696
ABSTRACT:
The present invention provides a method for fabricating semiconductor circuit modules having the following steps: application of a patterned connection layer to a transfer substrate, application of active circuit devices and/or passive circuit devices with contact areas pointing toward the patterned connection layer, connection of the circuit devices to one another by means of a filler at least between the circuit devices, removal of the transfer substrate, and application of electrical connection devices for selective contact connection of the contact area of the circuit devices to one another.
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Austrian Patent Office Search Report dates Oct. 7, 2005, 6 pages.
Frankowsky Gerd
Hedler Harry
Vasquez Barbara
Fish & Richardson P.C.
Infineon - Technologies AG
Jr. Carl Whitehead
Mitchell J
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