Semiconductor chip with coil element over passivation layer

Details Semiconductor chip with coil element over passivation layer Semiconductor chip with coil element over passivation layer

2006-05-17

2008-12-30

Nguyen, Ha Tran T (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Thin active physical layer which is

Heterojunction

C257S277000

Reexamination Certificate

active

07470927

ABSTRACT:
A method for fabricating a circuitry component includes providing a semiconductor substrate, a first coil over said semiconductor substrate, a passivation layer over said first coil; and depositing a second coil over said passivation layer and over said first coil. Said second coil may be deposited by forming a first metal layer over said passivation layer, forming a pattern defining layer over said first metal layer, a first opening in said pattern defining layer exposing said first metal layer, forming a second metal layer over said first metal layer exposed by said first opening, removing said pattern defining layer, and removing said first metal layer not under said second metal layer.

REFERENCES:
patent: 2005/0104158 (2005-05-01), Bhattacharjee et al.

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