Semiconductor device manufacturing: process – Making passive device
Reexamination Certificate
2011-07-26
2011-07-26
Thai, Luan C (Department: 2891)
Semiconductor device manufacturing: process
Making passive device
C438S329000, C438S238000, C438S622000, C438S210000
Reexamination Certificate
active
07985653
ABSTRACT:
A method for fabricating a circuitry component includes providing a semiconductor substrate, a first coil over said semiconductor substrate, a passivation layer over said first coil; and depositing a second coil over said passivation layer and over said first coil. Said second coil may be deposited by forming a first metal layer over said passivation layer, forming a pattern defining layer over said first metal layer, a first opening in said pattern defining layer exposing said first metal layer, forming a second metal layer over said first metal layer exposed by said first opening, removing said pattern defining layer, and removing said first metal layer not under said second metal layer.
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Chou Chien-Kang
Chou Chiu-Ming
Lee Jin-Yuan
Lee Wen-Chieh
Lin Mou-Shiung
McDermott Will & Emery LLP
Megica Corporation
Thai Luan C
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