Semiconductor chip with bond area

Details Semiconductor chip with bond area Semiconductor chip with bond area

2011-05-24

2011-05-24

Chambliss, Alonzo (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Test or calibration structure

C257S700000, C257S759000, C257S774000, C438S011000, C438S623000, C438S637000

Reexamination Certificate

active

07947978

ABSTRACT:
A semiconductor chip comprises a metal pad exposed by an opening in a passivation layer, wherein the metal pad has a testing area and a bond area. During a step of testing, a testing probe contacts with the testing area for electrical testing. After the step of testing, a polymer layer is formed on the testing area with a probe mark created by the testing probe. Alternatively, a semiconductor chip comprises a testing pad and a bond pad respectively exposed by two openings in a passivation layer, wherein the testing pad is connected to the bond pad. During a step of testing, a testing probe contacts with the testing pad for electrical testing. After the step of testing, a polymer layer is formed on the testing pad with a probe mark created by the testing probe.

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