Semiconductor chip, semiconductor device and electronic...

Details Semiconductor chip, semiconductor device and electronic... Semiconductor chip, semiconductor device and electronic...

2008-06-17

2008-06-17

Le, Thao X. (Department: 2892)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Warping of semiconductor substrate

C257S701000, C257S702000, C438S125000

Reexamination Certificate

active

07387945

ABSTRACT:
A semiconductor chip is provided that is highly packageable and particularly well suited for mounting on a circuit board having a curved surface. The semiconductor chip comprises a warpage control film that controls the warpage of a substrate.

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Shigeki Inoue, “Chrono-Bit Development and Packaging Technology”, Electronics Packaging Technology, vol. 16, No. 12, pp. 40-45 (2000).

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