Semiconductor chip package with center contacts

Details Semiconductor chip package with center contacts Semiconductor chip package with center contacts

1997-12-03

2000-10-17

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257701, H01L 2348, H01L 2352

Patent

active

061336270

ABSTRACT:
A semiconductor chip having contacts on the central region of its top surface is provided with a dielectric element overlying the central portion of the top surface. The dielectric element has a first surface facing toward the chip and a second surface facing away from the chip, a hole encompassing the central contacts and an edge bounding the hole. Central contact leads extend from the central contacts on the chip to central terminals on the dielectric element. The terminals on the dielectric element may be connected to a substrate using techniques commonly employed in surface mounting of electrical devices, such as solder bonding. The leads, and preferably the dielectric element, are flexible so that the terminals are moveable with respect to the contacts on the chip, to compensate for differential thermal expansion of the chip and substrate. The dielectric element may be provided with a compliant layer disposed between the terminals and the chip. The entire assembly is compact.

REFERENCES:
patent: Re35119 (1995-12-01), Blonder et al.
patent: T955008 (1977-02-01), Gregor et al.
patent: 3302067 (1967-01-01), Jackson et al.
patent: 3390308 (1968-06-01), Marley
patent: 3426252 (1969-02-01), Lepselter
patent: 3474297 (1969-10-01), Bylander
patent: 3487541 (1970-01-01), Boswell
patent: 3611061 (1971-10-01), Segerman
patent: 3614832 (1971-10-01), Chance et al.
patent: 3680037 (1972-07-01), Nellis et al.
patent: 3680206 (1972-08-01), Roberts
patent: 3683105 (1972-08-01), Shamash et al.
patent: 3689991 (1972-09-01), Aird
patent: 3724068 (1973-04-01), Galli
patent: 3772575 (1973-11-01), Hegarty et al.
patent: 3795037 (1974-03-01), Luttmer
patent: 3823467 (1974-07-01), Shamash et al.
patent: 3825353 (1974-07-01), Loro
patent: 3832769 (1974-09-01), Olyphant, Jr. et al.
patent: 3862790 (1975-01-01), Davies et al.
patent: 3864728 (1975-02-01), Peltz et al.
patent: 3868724 (1975-02-01), Perrino
patent: 3952404 (1976-04-01), Matunami
patent: 4179802 (1979-12-01), Joshi et al.
patent: 4189825 (1980-02-01), Robillard et al.
patent: 4237607 (1980-12-01), Ohno
patent: 4349862 (1982-09-01), Bajorek et al.
patent: 4356374 (1982-10-01), Noyori et al.
patent: 4410905 (1983-10-01), Grabbe
patent: 4437141 (1984-03-01), Prokop
patent: 4536469 (1985-08-01), Alderstein
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4574470 (1986-03-01), Burt
patent: 4597617 (1986-07-01), Enochs
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4627151 (1986-12-01), Mulholland et al.
patent: 4628406 (1986-12-01), Smith et al.
patent: 4648179 (1987-03-01), Bhattacharyya et al.
patent: 4649415 (1987-03-01), Hebert
patent: 4655524 (1987-04-01), Etzel
patent: 4658332 (1987-04-01), Baker et al.
patent: 4667220 (1987-05-01), Lee et al.
patent: 4670770 (1987-06-01), Tai
patent: 4681654 (1987-07-01), Clementi et al.
patent: 4685998 (1987-08-01), Quinn et al.
patent: 4695870 (1987-09-01), Patraw
patent: 4700473 (1987-10-01), Freyman et al.
patent: 4709468 (1987-12-01), Wilson
patent: 4710798 (1987-12-01), Marcantonio
patent: 4721993 (1988-01-01), Walter
patent: 4751199 (1988-06-01), Phy
patent: 4751482 (1988-06-01), Fukuta et al.
patent: 4764804 (1988-08-01), Sahara et al.
patent: 4766670 (1988-08-01), Godzik et al.
patent: 4772936 (1988-09-01), Reding et al.
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4783719 (1988-11-01), Jamison et al.
patent: 4793814 (1988-12-01), Zifcak et al.
patent: 4796078 (1989-01-01), Phelps, Jr. et al.
patent: 4811082 (1989-03-01), Jacobs et al.
patent: 4814295 (1989-03-01), Mehta
patent: 4818728 (1989-04-01), Rai et al.
patent: 4842662 (1989-06-01), Jacobi
patent: 4847146 (1989-07-01), Yeh et al.
patent: 4855867 (1989-08-01), Gazdik et al.
patent: 4855872 (1989-08-01), Wojnar et al.
patent: 4860088 (1989-08-01), Smith et al.
patent: 4866841 (1989-09-01), Hubbard
patent: 4874721 (1989-10-01), Kimura et al.
patent: 4878098 (1989-10-01), Saito et al.
patent: 4884122 (1989-11-01), Eichelberger et al.
patent: 4887148 (1989-12-01), Mu
patent: 4890157 (1989-12-01), Wilson
patent: 4893172 (1990-01-01), Matsumoto et al.
patent: 4897534 (1990-01-01), Haghiri-Tehrani
patent: 4918811 (1990-04-01), Eichelberger et al.
patent: 4924353 (1990-05-01), Patraw
patent: 4926241 (1990-05-01), Carey
patent: 4937203 (1990-06-01), Eichelberger et al.
patent: 4937653 (1990-06-01), Blonder et al.
patent: 4937707 (1990-06-01), McBride et al.
patent: 4941033 (1990-07-01), Kishida
patent: 4942140 (1990-07-01), Ootsuki et al.
patent: 4954878 (1990-09-01), Fox et al.
patent: 4961105 (1990-10-01), Yamamoto
patent: 4967261 (1990-10-01), Niki et al.
patent: 4975765 (1990-12-01), Ackermann et al.
patent: 4989069 (1991-01-01), Hawkins
patent: 4993954 (1991-02-01), Prevost
patent: 5006673 (1991-04-01), Freyman et al.
patent: 5019673 (1991-05-01), Juskey et al.
patent: 5023205 (1991-06-01), Reche
patent: 5027191 (1991-06-01), Bourdelaise et al.
patent: 5029325 (1991-07-01), Higgins, III et al.
patent: 5045921 (1991-09-01), Lin et al.
patent: 5045922 (1991-09-01), Kodama et al.
patent: 5053922 (1991-10-01), Matta et al.
patent: 5055907 (1991-10-01), Jacobs
patent: 5055913 (1991-10-01), Haghiri-Tehrani
patent: 5086337 (1992-02-01), Noro et al.
patent: 5117275 (1992-05-01), Bregman
patent: 5123850 (1992-06-01), Elder et al.
patent: 5136366 (1992-08-01), Worp et al.
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5192716 (1993-03-01), Jacoby
patent: 5210939 (1993-05-01), Mallik et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5217916 (1993-06-01), Anderson et al.
patent: 5222014 (1993-06-01), Lin
patent: 5227583 (1993-07-01), Jones
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5282312 (1994-02-01), DiStefano et al.
patent: 5289346 (1994-02-01), Carey et al.
patent: 5346861 (1994-09-01), Khandros et al.
patent: 5347159 (1994-09-01), Khandros et al.
patent: 5350947 (1994-09-01), Takekawa et al.
patent: 5379191 (1995-01-01), Carey et al.
patent: 5394009 (1995-02-01), Loo
patent: 5414298 (1995-05-01), Grube et al.
patent: 5454160 (1995-10-01), Nickel
patent: 5477082 (1995-12-01), Buckley, III et al.
patent: 5504035 (1996-04-01), Rostoker et al.
patent: 5518964 (1996-05-01), DiStefano et al.
patent: 5550401 (1996-08-01), Maeda
patent: 5552631 (1996-09-01), McCormick
patent: 5637919 (1997-06-01), Grabbe
patent: 5679977 (1997-10-01), Khandros et al.
patent: 5685885 (1997-11-01), Khandros et al.
patent: 5763952 (1998-06-01), Lynch et al.
JP 63-290796, copy including annotations.
JP 63-51196, copy including annotations.
JP 63-290795, copy including annotations.
Jp 2-128453, copy including annotations.
1987 Proceedings 37.sup.th Electronic Components Conference, May 11-13, 1987, Die Attachment Design and Its Influence on Thermal Stresses in the Die and the Attachment, E. Suhir, pp. 508-517.
Electronic Components Confernce 33.sup.rd, May 16-18, 1983, The Quality of Die-Attachment and Its Relationship to Stresses and Vertical Die-Cracking, C.G.M. van Kessel, S.A. Gee and J.J. Murphy, pp. 237-244.
Electronic Components Conference 34.sup.th, May 14-16, 1984, Die Attach in Hi-Rel P-Dips: Polymides or Low Chloride Epoxies?, Justin C. Bolger and Charles T. Mooney, pp. 63-67.
Ablebond.RTM. 84-3 MV, Electrically Insulating Epoxy Adhesive, Dec. 1997.
Ablebond.RTM. 84-3 MV, One Component, Insulative Chip Adhesive, Nov. 1997.
Ablebond.RTM. 84-3MV, Electrically Insulating Chip Adhesive, Rev. Jun. 1990.
Ablestik.RTM., One Component, Insulating Chip Adhesive, Rev. Feb. 1988.
Microelectronics Packaging Handbook, Rao R. Tummala, Eugene J. Rymaszewski, pp. 312-320, (1989).
"No Stress" Dielectric Epoxy Adhesives with High Thermal Conductivity, date unknown.
Nitto Product Information. "New Tab Mounting Method".
IBM Technical Disclosure Bulletin. Jan. 1985, vol. 27, No. 9, p. 4855.
IBM Technical Disclosure Bulletin. "Non-Permanent Mounting Technique for Test and Burn--In of C4 Devices". Nov. 1990, vol. 33, No. 7.
IBM Technical Disclosure Bulletin. "Extended Pad for Testing Package Parts". Dec. 1984, vol. 27, No. 7B, pp. 4210-4211.
IBM Technical Disclosure Bulletin. "Test and Repai

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