Semiconductor chip package, electronic device including the...

Details Semiconductor chip package, electronic device including the... Semiconductor chip package, electronic device including the...

2011-08-30

2011-08-30

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S780000, C257S781000, C257SE21508, C257SE23021

Reexamination Certificate

active

08008771

ABSTRACT:
A semiconductor chip package including a semiconductor chip including a first surface having bonding pads, a second surface facing the first surface, and sidewalls; a molding extension part surrounding the second surface and the sidewalls of the semiconductor chip; redistribution patterns extending from the bonding pads over the molding extension part, and electrically connected to the bonding pads; bump solder balls on the redistribution patterns; and a molding layer configured to cover the first surface of the semiconductor chip and the molding extension part, while exposing portions of each of the bump solder balls. The molding layer has concave meniscus surfaces between the bump solder balls adjacent to each other.

REFERENCES:
patent: 6972249 (2005-12-01), Akram et al.
patent: 2005/0082670 (2005-04-01), Quinones et al.

Affiliated with

Also associated with

Rating

Semiconductor chip package, electronic device including the... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor chip package, electronic device including the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor chip package, electronic device including the... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2744611