Semiconductor chip package and printed circuit board having...

Details Semiconductor chip package and printed circuit board having... Semiconductor chip package and printed circuit board having...

2011-08-23

2011-08-23

Dickey, Thomas L (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Outside periphery of package having specified shape or...

C257SE23141, C257SE23010

Reexamination Certificate

active

08004081

ABSTRACT:
A semiconductor chip package includes a signal interconnection penetrating a semiconductor chip and transmitting a signal to the semiconductor chip and a power interconnection and a ground interconnection penetrating the semiconductor and supplying power and ground to the semiconductor chip. The power interconnection and the ground interconnection are arranged to neighbor each other adjacent to the signal interconnection.

REFERENCES:
patent: 6111756 (2000-08-01), Moresco
patent: 7154356 (2006-12-01), Brunette et al.
patent: 2004/0251529 (2004-12-01), Lee et al.
patent: 2001-148448 (2001-05-01), None
patent: 2002-329802 (2002-11-01), None
patent: 2007-180292 (2007-07-01), None

Affiliated with

Also associated with

Rating

Semiconductor chip package and printed circuit board having... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor chip package and printed circuit board having..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor chip package and printed circuit board having... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2708496