Semiconductor chip package

Details Semiconductor chip package Semiconductor chip package

2008-05-13

2008-05-13

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE23079, C257SE23069, C257SE23070, C257SE23172, C257SE23061, C257SE23101, C257SE23114, C257SE23126, C257SE23065, C257SE25030, C257SE25023, C257S668000, C257S723000, C257S724000, C257S728000, C257S691000, C257S690000, C257S735000, C257S528000, C257S531000

Reexamination Certificate

active

11108794

ABSTRACT:
A semiconductor chip package may include a substrate, which may have bonding pads formed thereon. A semiconductor chip mounted on the substrate may have chip pads, and electrical connections for connecting the chip pads of the semiconductor chip to the substrate bonding pads. The semiconductor chip and the electrical connections on the substrate may be encapsulated, and a board attached to a portion of a surface of the substrate may not be encapsulated.

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Notice of Examination Report for corresponding Korean Application No. 10-2004-27190 dated Feb. 27, 2006.

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