Semiconductor chip mounting substrate, a method of producing...

Details Semiconductor chip mounting substrate, a method of producing... Semiconductor chip mounting substrate, a method of producing...

2007-05-11

2008-11-18

Ha, Nathan W (Department: 2814)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

Reexamination Certificate

active

07452798

ABSTRACT:
A chip mounting substrate for bonding a semiconductor chip to a substrate, comprises a solder layer on the substrate, the solder layer being connectable to a semiconductor chip, wherein the solder layer comprises a layer including δ-phase crystal grains of an Au—Sn alloy at a surface of the solder layer. The solder layer comprising a layer including δ-phase crystal grains of an Au—Sn alloy is formed at a surface of the solder layer. On mounting a semiconductor chip on the substrate, the substrate and the solder layer are heated and an image of the solder layer is shot to perform an image evaluation to detect the timing of mounting the semiconductor chip on the solder layer of the substrate and a position of the chip.

REFERENCES:
patent: 7009299 (2006-03-01), Angst et al.
patent: 2001-57468 (2001-02-01), None

Affiliated with

Also associated with

Rating

Semiconductor chip mounting substrate, a method of producing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor chip mounting substrate, a method of producing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor chip mounting substrate, a method of producing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4043611