Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1994-04-22
1996-06-11
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257706, 257719, 257722, 257724, 361688, 361692, 361697, 361713, H01L 2334, H01L 2310, H02B 120, H02K 0720
Patent
active
055258352
ABSTRACT:
The semiconductor chip module according to the present invention comprises a semiconductor substrate on which a wiring portion is formed, a semiconductor chip 4 mounted so as to face a circuit side up to the wiring portion, a heat sink 3, 3a, 13 with one end contacted to the central portion of an upper surface of the semiconductor chip 4, 4a; and a cap which has an opening 2a for exposing the other end of the heat sink 3, 3a, 13 to the outside, the cap 2 enclosing all of the semiconductor chips 4, 4a. Accordingly, the heat generated from the semiconductor chips 4, 4a can be dissipated through the heat sink 3, 3a, 13 to the outside. It results in providing a semiconductor chip module without inconvenience for operation with high speed.
REFERENCES:
patent: 4376287 (1983-03-01), Sechi
patent: 4827376 (1989-05-01), Voss
Peterson, "Silicones with Improved Thermal Conductivity for Thermal Management in Electronic Packaging", Proceedings of the 40th Electronic Components & Technology Conference, May 20, 1990, pp. 613-619.
Watari et al, "Packaging Technology for the NEC SX Supercomputer", IEEE Transactions on Components, Hybrids and Manufacturing Technology, vol. 8, No. 4, Dec. 1985, pp. 462-467.
Crane Sara W.
Jr. Carl Whitehead
Sumitomo Electric Industries Ltd.
LandOfFree
Semiconductor chip module having an electrically insulative ther does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor chip module having an electrically insulative ther, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor chip module having an electrically insulative ther will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-353812