Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent
1997-03-05
1999-08-31
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
257666, 257778, 257713, 257737, H01L 2348
Patent
active
059457414
ABSTRACT:
A semiconductor device employs interconnecting films on film circuit as ground lines which extend to the periphery of the film circuit where there is a further connection to a conductive reinforcing plate. Advantageously the conductive reinforcing plate reduces electrical noise from interfering with the semiconductor device and prevents the semiconductor device from radiating undesired signals. The interconnecting films also reduce cross-talk between signal lines of the semiconductor device.
REFERENCES:
patent: 5359222 (1994-10-01), Okutomo et al.
patent: 5519936 (1996-05-01), Andros et al.
patent: 5659198 (1997-08-01), Okutomo et al.
Ito Makoto
Ohsawa Kenji
Otsuka Yasushi
Sato Kazuhiro
Jr. Carl Whitehead
Sony Corporation
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