Semiconductor chip housing having a reinforcing plate

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

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Details

257666, 257778, 257713, 257737, H01L 2348

Patent

active

059457414

ABSTRACT:
A semiconductor device employs interconnecting films on film circuit as ground lines which extend to the periphery of the film circuit where there is a further connection to a conductive reinforcing plate. Advantageously the conductive reinforcing plate reduces electrical noise from interfering with the semiconductor device and prevents the semiconductor device from radiating undesired signals. The interconnecting films also reduce cross-talk between signal lines of the semiconductor device.

REFERENCES:
patent: 5359222 (1994-10-01), Okutomo et al.
patent: 5519936 (1996-05-01), Andros et al.
patent: 5659198 (1997-08-01), Okutomo et al.

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