Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2011-01-04
2011-01-04
Nguyen, Ha Tran T (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
Reexamination Certificate
active
07863917
ABSTRACT:
A semiconductor chip includes a line structure arranged along a peripheral region of the semiconductor chip region in order to inspect a crack, a first pad and second pad arranged on different end portions of the line structure, a second pad arranged on another end portion of the line structure, an inspection device activated during a crack test mode to electrically connect the first pad, the line structure and the second pad. The inspection device may include a first switching circuit connected between the first pad and the line structure, the first switching circuit being deactivated during a normal operation mode and being activated a crack test mode; and a second switching circuit connected between the second pad and the line structure, the second switching circuit being deactivated during the normal operation mode and being activated during the crack test mode.
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Benitez Joshua
Harness & Dickey & Pierce P.L.C.
Nguyen Ha Tran T
Samsung Electronics Co,. Ltd.
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